Description
Hybrid heating type of high-frequency induction heating to heat the wafers, and heater for heating the raw materials.
It can process a maximum of 16 wafers. before-processed wafers are taken out from the wafer stocker, transported, heat-treated, and returned to the wafer stocker by fully automatic process.
When exchanging wafers after heat treatment, the temperature is lowered once, but by high-frequency induction heating, the temperature can be raised again very rapidly, this shorten the running time for 1 batch.
Feature
- Wafers can be heat-treated continuously
- Maximum number of process is 16 sheets
- Fully automated from transfer to heat treatment of wafer
- Hybrid heating (high frequency induction heating + heater heating)
- Space&energy-saving design
Specification
| Heating method | High frequency induction heating + heater heating (3 zones) |
|---|---|
| Heating temperature | 1200℃ |
| Atmosphere | Inert gas atmosphere after vacuum |
| Wafer size | 6 inches |
| Number of processing sheets | 16 sheets |